Inline Visual Dispensing Machine for Wire Bonding Gold Wire Encapsulation

The GS600M Inline Visual Dispensing Machine is a precision-engineered inline dispensing solution designed to meet the ultra-high requirements of gold wire encapsulation in advanced wire bonding applications.

Equipped with a high-resolution visual alignment system, the GS600M detects fine wire positions and calculates optimal dispensing paths in real time. Its advanced low-level alarm module prevents unexpected interruptions by monitoring fluid levels and ensuring consistent glue supply throughout production.

The GS600M supports both single-valve micro-dispensing for precise adhesive control and double-valve configurations for higher throughput where needed. Its rigid mineral cast frame minimizes vibration, maintaining stable, consistent performance in high-volume wire bonding lines.

Key Advantages

• Ultra-Precise KOZ Control: Guarantee accurate glue placement within a 10μm tolerance, safeguarding gold wire loops and preventing accidental bending or damage.

• Consistent, Even Glue Dispensing: Advanced valve control and visual inspection ensure every encapsulation is uniform, preventing underfill or overflow that could compromise wire integrity.

• Real-Time Visual Positioning: Integrated mark recognition and product appearance alignment enable adaptive path correction for complex wire patterns.

• Low-Level Alarm Module: Proactively alerts operators when adhesive supply is low, minimizing downtime and avoiding incomplete encapsulations.

Typical Applications

✔ Gold Wire Encapsulation for Wire Bonding
✔ KOZ-Controlled Underfill for Semiconductor Packaging
✔ Fine-Pitch Die Attach Encapsulation
✔ ASIC and MEMS Chip Bonding Protection
✔ SMD Reinforcement and Potting
✔ Micro Sensor Wire Loop Protection

Key Specifications

FAQ

Q1: Why is KOZ control so critical for wire bonding?
A: Any glue overflow or misplacement can damage fine gold wires or cause electrical shorts. The GS600 series’s KOZ control ensures glue stays exactly where needed, protecting bond loops.

Q2: Can the GS600 series be used with UV-curable adhesives?
A: Yes. The system is compatible with a wide range of adhesives, including UV, epoxy, and underfill materials commonly used in semiconductor wire bonding.

Q3: Does the machine support high-mix production?
A: Absolutely. The system’s flexible configuration and recipe management allow fast model changeover, ideal for varied product runs.

Q4: How does it prevent whole line downtime?
A: Each track operates independently, and the conveyor track design separates maintenance areas — minimizing unplanned stops for the entire line.

Conclusion

Achieve unmatched precision, protect your gold wires, and meet the toughest encapsulation requirements — choose the GS600M for wire bonding encapsulation that sets your production apart.

Contact us for a custom demo and unlock next-level precision for your packaging line!

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.